Vacuum hot pressing bonding for thermoplastic polymer microfluidics - Wenhao

WH-2000A Vacuum thermocompression bonder for Hard plastic chips is developed by Suzhou Wenliu Microfluidic Technology Co., Ltd. for the bonding of rigid plastic chips such as PMMA, PC, COC, etc. It is a hard plastic microfluidic chip processing Professional setting.

Vacuum thermocompression bonder for Hard plastic chips(PMMA/PC) features：

(1) the use of constant temperature control heating technology, precise temperature control;

(2) aluminum work platform, the upper and lower surface formation, heat conduction speed, thermal conductivity are uniform;

(3) heating area, covering the commonly used size chip;

(4) air cooling, cooling rate uniform, help to improve the bonding effect;

(5) the pressure is precisely adjustable, different pressure control for different materials;

(6) a unique vacuum hot pressing system, the chip is not damaged in the case of greatly improve the bonding

Vacuum thermocompression bonder for Hard plastic chips(PMMA/PC) technical parameters：

1, Dimensions: 470 × 415 × 876 (L × W × H) mm;

2, Weight: 80kg;

3, working panel area: 230 × 200 (length × width) mm;

4, chip thickness can be bonded: 0 ~ 140mm;

5, Rated voltage: AC220V / 50HZ;

6, the pressure range: 0 ~ 5kN;

7, rated power: 1.4KW;

8, rated maximum temperature: 200 ℃;